ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,659, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including semiconduc... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,660, issued on Sept. 22, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Jap... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,661, issued on Sept. 22, was assigned to Apple Inc. (Cupertino, Calif.). "Scalable extreme large size substrate integration" was invented ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,662, issued on Sept. 22, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Molded thin semiconductor die packa... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,663, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Singulation of integrated circuit package substrates with gla... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,664, issued on Sept. 22, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Wire bonding arrays, maintenance stati... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,665, issued on Sept. 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Substrate and method of manufacturin... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,666, issued on Sept. 22, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Package structures, fabricating methods the... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,667, issued on Sept. 22, was assigned to TDK Corp. (Tokyo). "Electronic circuit package, its manufacturing method, and electronic device h... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,668, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Dam surrounding a die on a substrate" was invented by Liang H... Read More